Selective Soldering Machine HPS5

Key Features:

• Compact and Durable Design:
  The machine is built with a robust frame and efficient layout, ensuring durability and ease of use while optimizing floor space.
• Precision Solder Pot with Electromagnetic Pump:
  Equipped with an advanced electromagnetic pump system, the solder pot delivers accurate and controlled solder flow for precise soldering, reducing defects and rework.
• Adjustable Transport Width:
  The transport system allows for width adjustments to accommodate various PCB sizes, offering flexibility for multiple production needs.
• High Accuracy and Repeatability:
  The machine delivers consistent solder joints with high positional accuracy, ensuring reliable performance across multiple soldering points.
• Low Nitrogen Consumption:
  The system is engineered to minimize nitrogen usage, resulting in cost-effective operation while maintaining a clean soldering environment.
• Single Track and Dual Pot Options:
  The soldering system provides flexibility with single track single pot or dual pot configurations to adapt to production scale and requirements.
• Modular Design:
  Supports one, two, or three module setups, enabling efficient scalability and the ability to handle varying production volumes.

Technical Specifications:

• Dimensions: Varies by model (e.g., 4200×1915×1571 mm).
• PCB Size: Supports PCBs up to 510×510 mm.
• Conveyor Height: 900 ± 20 mm for smooth PCB handling.
• Transport Width Adjustment: Up to 510 mm for flexible board configurations.
• Solder Pot: Advanced solder pot system with precise electromagnetic pumping technology.
• Tin Dross Control: Efficient operation ensures minimal tin waste, saving material costs.
• Nitrogen Consumption: Optimized at 1.5-2 m³/h for reduced operational costs.

Applications:

• Through-hole components for complex assemblies
• Automotive electronics
• Communication devices
• Consumer electronics
• Industrial control systems

Why Choose Our Selective Soldering Machine?

• High precision and reliability for critical solder joints
• Flexibility to handle various board sizes and production needs
• Cost-saving features such as low nitrogen consumption and reduced tin dross
• Scalability with modular designs to match growing production requirements